Cooler Master HTK-002. Thermal conductivity: 4.5 W/mK, Product colour: White, Thermal resistance: 0.02 C/W. Weight: 4.6 g. Quantity per pack: 1 pc(s), Package width: 102 mm, Package depth: 171 mm
HTK-002
Cooler Master HTK-002-U1 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. - Suitable for CPU, chipsets on Mainboard, VGA card, etc. - Easy to use.- Zif Socket Templates ensure correct applying area with various CPU socket types.- Produces an even layer when using applicator.- Dielectric.- Wide range of application temperature.These compounds resist changes in consistency at temperatures up to 177C (350F), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.ColourWhiteVolume2gSpecific Gravity2.37Viscosity/FlowabilityNon-FlowingShelf Life24 months from DOMThermal Conductivity0.8 watts/meter-CVolume Resistivity5.0 x 1015Dielectric Constant4.4 at 100k HzDissipation Factor0.02 at 100k HzDielectric Strength550 volts/mil; 21.7 kV/mm>4.5 W/m-K, 0.02 C-in2/W, 4.6 g
Cooler Master HTK-002. Thermal conductivity: 4.5 W/m·K, Product colour: White, Thermal resistance: 0.02 °C/W. Weight: 4.6 g. Quantity per pack: 1 pc(s), Package width: 102 mm, Package depth: 171 mm
29/06/2006